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Rogers RT/Duroid 5880 PCB 0.9mm High Frequency PCB Plated Through Hole

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Rogers RT/Duroid 5880 PCB 0.9mm High Frequency PCB Plated Through Hole

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Brand Name : Bicheng

Model Number : BIC-022.V1.0

Certification : UL, ISO9001, IATF16949

Place of Origin : CHINA

MOQ : 1PCS

Price : USD9.99-99.99

Payment Terms : T/T

Supply Ability : 5000PCS per month

Delivery Time : 8-9 working days

Packaging Details : Vacuum bags+Cartons

Base material : RT/Duroid 5880

Layer count : 2 layers

PCB thickness : 0.9mm

PCB size : 91 x 62mm=1PCS

Copper weight : 1oz

Surface finish : immersion gold

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Rogers RT/Duroid 5880 31mil 0.787mm High Frequency PCB for Point to Point Digital Radio Antennas

(Printed Circuit Boards are custom-made products, the picture and parameters shown are just for reference)

Rogers RT/duroid 5880 high frequency material is glass microfiber reinforced PTFE composites which is designed for exacting stripline and microstrip circuit applications. The exceptional dielectric constant uniformity results from its randomly oriented microfibers. The dielectric constant of RT/duroid 5880 is uniform from panel to panel and is constant over a wide frequency range. Its low dissipation factor extends the usefulness of RT/duroid 5880 to Ku-band and above. RT/duroid 5880 materials are easily cut, sheared and machined to shape. They are resistant to all solvents and reagents, hot or cold, normally used in etching printed circuits or in plating edges and holes.

Typical applications:

-commercial airline broadband antennas

-microstrip circuits

-stripline circuits

-millimeter wave applications

-military radar systems

-missile guidance systems and point to point digital radio antennas etc.

PCB Specifications

PCB SIZE 91 x 62mm=1PCS
BOARD TYPE Double sided PCB
Number of Layers 2 layers
Surface Mount Components YES
Through Hole Components YES
LAYER STACKUP copper ------- 35um(1 oz)+plate TOP layer
RT/duroid 0.787mm (31 mil)
copper ------- 35um(1oz) + plate BOT Layer
TECHNOLOGY
Minimum Trace and Space: 4 mil / 4 mil
Minimum / Maximum Holes: 0.3 mm / 4.2 mm
Number of Different Holes: 9
Number of Drill Holes: 101
Number of Milled Slots: 0
Number of Internal Cutouts: 0
Impedance Control: no
Number of Gold finger: 0
BOARD MATERIAL
Glass Epoxy: RT/duroid 0.787mm (31 mil)
Final foil external: 1 oz
Final foil internal: N/A
Final height of PCB: 0.9 mm ±0.1
PLATING AND COATING
Surface Finish Immersion gold
Solder Mask Apply To: N/A
Solder Mask Color: N/A
Solder Mask Type: N/A
CONTOUR/CUTTING Routing
MARKING
Side of Component Legend N/A
Colour of Component Legend N/A
Manufacturer Name or Logo: N/A
VIA Plated through hole(PTH), minimum size 0.3mm.
FLAMIBILITY RATING UL 94-V0 Approval MIN.
DIMENSION TOLERANCE
Outline dimension: 0.0059"
Board plating: 0.0029"
Drill tolerance: 0.002"
TEST 100% Electrical Test prior shipment
TYPE OF ARTWORK TO BE SUPPLIED email file, Gerber RS-274-X, PCBDOC etc
SERVICE AREA Worldwide, Globally.

Rogers RT/Duroid 5880 PCB 0.9mm High Frequency PCB Plated Through Hole

Data Sheet of Rogers 5880 (RT/duroid 5880)

RT/duroid 5880 Typical Value
Property RT/duroid 5880 Direction Units Condition Test Method
Dielectric Constant,εProcess 2.20
2.20±0.02 spec.		 Z N/A C24/23/50
C24/23/50		 1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
Dielectric Constant,εDesign 2.2 Z N/A 8GHz to 40 GHz Differential Phase Length Method
Dissipation Factor,tanδ 0.0004
0.0009		 Z N/A C24/23/50
C24/23/50		 1 MHz IPC-TM-650 2.5.5.3
10 GHz IPC-TM 2.5.5.5
Thermal Coefficient of ε -125 Z ppm/℃ -50℃to 150℃ IPC-TM-650 2.5.5.5
Volume Resistivity 2 x 107 Z Mohm cm C/96/35/90 ASTM D 257
Surface Resistivity 3 x 107 Z Mohm C/96/35/90 ASTM D 257
Specific Heat 0.96(0.23) N/A j/g/k
(cal/g/c)		 N/A Calculated
Tensile Modulus Test at 23℃ Test at 100℃ N/A MPa(kpsi) A ASTM D 638
1070(156) 450(65) X
860(125) 380(55) Y
Ultimate Stress 29(4.2) 20(2.9) X
27(3.9) 18(2.6) Y
Ultimate Strain 6 7.2 X %
4.9 5.8 Y
Compressive Modulus 710(103) 500(73) X MPa(kpsi) A ASTM D 695
710(103) 500(73) Y
940(136) 670(97) Z
Ultimate Stress 27(3.9) 22(3.2) X
29(5.3) 21(3.1) Y
52(7.5) 43(6.3) Z
Ultimate Strain 8.5 8.4 X %
7.7 7.8 Y
12.5 17.6 Z
Moisture Absorption 0.02 N/A % 0.62"(1.6mm) D48/50 ASTM D 570
Thermal Conductivity 0.2 Z W/m/k 80℃ ASTM C 518
Coefficient of Thermal Expansion 31
48
237		 X
Y
Z		 ppm/℃ 0-100℃ IPC-TM-650 2.4.41
Td 500 N/A ℃ TGA N/A ASTM D 3850
Density 2.2 N/A gm/cm3 N/A ASTM D 792
Copper Peel 31.2(5.5) N/A Pli(N/mm) 1oz(35mm)EDC foil
after solder float		 IPC-TM-650 2.4.8
Flammability V-0 N/A N/A N/A UL 94
Lead-free Process Compatible Yes N/A N/A N/A N/A

Rogers RT/Duroid 5880 PCB 0.9mm High Frequency PCB Plated Through Hole


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